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Companies That Accept Internship Applications

Information on companies and institutes that host interns

The following is general recruiting information for interns hosted by companies interested in students from Hokkaido University School of Engineering/Graduate School of Engineering/Graduate School of Information Science and Technology/Graduate School of Chemical Sciences and Engineering.

Inquiry

Office of the Center for Engineering Education Development (room L200)
Tel.: 011-706-7163
E-mail: ceed-ind◆eng.hokudai.ac.jp
*Replace ◆ with an at sign.

List of companies and institutes that host interns

*When applying directly on a personal basis, you are required to mail a copy of the application forms to the CEED office, and to notify the office of the result of your application.
*When applying via the CEED, you are required to mail the necessary documents to the CEED office.
*DS: Domestic sort-term DL: Domestic long-term OS: Overseas ENG:Engineering students only

2020 (Domestic) / 2020 (Overseas)

2020(Domestic)

Please swipe to see.

Update Categories Host bodies Notes
2020/09/23 DS Nomura-Research-Institute-Ltd. Refer to the following link for further information.
Application guidelines
2020/08/07 DS JDC-CORPORATION Refer to the following link for further information.
Application guidelines
2020/08/06 DS Bank-of-Japan Refer to the following link for further information.
Application guidelines
2020/08/05 DS Tokushima-Prefecture Refer to the following link for further information.
Application guidelines
2020/08/04 DS Oriental-Consultants-Global-Co.-Ltd. Refer to the following link for further information.
Application guidelines
2020/07/31 DS Yokogawa-Bridge-Holdings-Corp. Refer to the following link for further information.
Application guidelines
2020/07/27 DS
ENG
NIPPON-STEEL-CORPORATION Refer to the following link for further information.
Application guidelines
2020/07/14 DL National-Institute-for-Materials-Science(NIMS) Refer to the following link for further information.
Application guidelines
2020/07/14 DS Nagano-Prefecture Refer to the following link for further information.
Application guidelines
2020/07/14 DS MITSUBISHI-HEAVY-INDUSTRIES-ENVIRONMENTAL-CHEMICAL-ENGINEERING Refer to the following link for further information.
Application guidelinesApplication forms
2020/07/14 DS FUJI-ELECTRIC-CO.-LTD. Refer to the following link for further information.
Application guidelines
2020/07/14 DS ADVANTEST Refer to the following link for further information.
Application guidelines
2020/06/26 DL East-Japan-Railway-Company Refer to the following link for further information.
Application guidelines
2020/06/26 DS JX-Nippon-Oil-Gas-Exploration Refer to the following link for further information.
Application guidelinesApplication forms
2020/06/22 DS JFE-Steel-Corporation Refer to the following link for further information.
Application guidelines
2020/06/18 DS
ENG
UHB Refer to the following link for further information.
Application guidelines
2020/06/18 DL KPMG Ignition Tokyo Refer to the following link for further information.
Application guidelines
2020/06/17 DS Toyoda Gosei Co., Ltd. Refer to the following link for further information.
Application guidelines
2020/06/17 DS Nippon Sheet Glass Company, Ltd Refer to the following link for further information.
Application guidelines
2020/06/08 DS Railway-Technical-Research-Institute Refer to the following link for further information.
Application guidelines
2020/06/04 DS Nomura-Research-Institute-Ltd Refer to the following link for further information.
Application guidelines
2020/06/04 DS TOSHIBA-PLANT-SYSTEMS-SERVICES-CORPORATION Refer to the following link for further information.
Application guidelines
2020/04/13 DL
ENG
Mitsubishi-Aircraft-Corporation Refer to the following link for further information.
※To open the file,please send us an email to ask for the password.
Application guidelinesApplication forms
Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by May 22th.
2020/04/13 DL
ENG
toshiba Refer to the following link for further information.
※To open the file,please send us an email to ask for the password.
Application guidelinesApplication forms
Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by June 10th.The information seminar will be held on June 5.Refer to the following link for further information.
the information seminar
Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by May 28th.
2020/03/04 DS wakasuzu-consultants Refer to the following link for further information.
Application guidelines
2019/10/18 DL Mitsubishi Aircraft Corporation Refer to the following link for further information.
※To open the file,please send us an email to ask for the password.
Application guidelinesApplication forms
Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by December 20th.

2020 (Overseas)

Please swipe to see.

Update Categories Host bodies Notes
2020/07/14 OS
ENG
National Chung Cheng University
(Taiwan)
Program Schedule:for 6 weeks from August to September
Cancelled for the year of 2020 due to Covid-19 pandemic.
2020/07/14 OS
ENG
International Islamic University Malaysia
(Malaysia)
Deadline: 07/08/2020
※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline.
Engineering: 4 students
They will provide accommodation.
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2020/07/14 OS
ENG
Seoul National University
(Korea)
Deadline: 07/08/2020
※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline.
Engineering: 5 students
They will provide financial support for maximum 2 months.
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2020/07/14 OS
ENG
Queensland University of Technology
(Australia)
Deadline: 07/08/2020
※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline.
Engineering: 2 students
They will provide financial support for maximum 2 months.
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2020/07/14 OS
ENG
University of Alberta
(Canada)
Deadline: 07/08/2020
※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline.
Engineering: 2 students
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2020/07/14 OS
ENG
Rice University
(USA)
Deadline: 07/08/2020
※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline.
Engineering: 1 student
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2020/07/14 OS
ENG
University of Tulsa
(USA)
Deadline: 07/08/2020
※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline.
Engineering: 1 student
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2020/07/14 OS
ENG
Tampere University of Applied Sciences
(Finland)
Deadline: 07/08/2020
※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline.
Engineering: 2 students
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2020/07/14 OS
ENG
Steinmüller Engineering
(Germany)
Deadline: 07/08/2020
※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline.
Engineering: 1 graduate student
They will provide accommodation.
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2020/07/14 OS
ENG
TRUMPF
(Germany)
Cancelled for the year of 2020 due to Covid-19 pandemic.
2020/07/14 OS
ENG
Takasago Thermal Engineering
(Malaysia)
Cancelled for the year of 2020 due to Covid-19 pandemic.
2020/02/07 OS Rice University
(USA)
Program Schedule:13/08/2020~21/09/2020
Deadline: 26/02/2020
Refer to the following link for further information.
Program
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.