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Companies That Accept Internship Applications

*Information as of March. We will update as soon as possible.

Information on companies and institutes that host interns

The following is general recruiting information for interns hosted by companies interested in students from Hokkaido University School of Engineering/Graduate School of Engineering/Graduate School of Information Science and Technology/Graduate School of Chemical Sciences and Engineering.

Inquiry

Office of the Center for Engineering Education Development (room L200)
Tel.: 011-706-7163
E-mail: ceed-ind◆eng.hokudai.ac.jp
*Replace ◆ with an at sign.

List of companies and institutes that host interns

*When applying directly on a personal basis, you are required to mail a copy of the application forms to the CEED office, and to notify the office of the result of your application.
*When applying via the CEED, you are required to mail the necessary documents to the CEED office.
*DS: Domestic sort-term DL: Domestic long-term OS: Overseas

2020 (Domestic) / 2020 (Overseas) / In 2019 or earlier
Internship destinations (Japanese (related) companies which actively accept HU students) (PDF file)

2020(Domestic)

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Update Categories Host bodies Notes
2020/03/04 DS wakasuzu consultants Refer to the following link for further information.
Application guidelines
2019/10/18 DL Mitsubishi Aircraft Corporation Refer to the following link for further information.

Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by December 20th.

2020 (Overseas)

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Update Categories Host bodies Notes
2020/02/07 OS Rice University
(USA)
Program Schedule:13/08/2020~21/09/2020
Deadline: 26/02/2020
Refer to the following link for further information.
Program
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.

In 2019 or earlier

Please swipe to see.

Update Categories Host bodies Notes
2019/12/16 DS OKAMURA CORPORATION Refer to the following link for further information.
Application guidelines
2019/12/16 DS Railway Technical Research Institute Refer to the following link for further information.
Application guidelines
2019/12/16 DS Hokkaido Electric Power Co.,Inc. Refer to the following link for further information.
Application guidelines
2019/12/16 DS MUFG Bank, Ltd. Refer to the following link for further information.
Application guidelines
2019/11/27 DS Mitsubishi Corporation Exploration Co., Ltd. Refer to the following link for further information.
Application guidelines
2019/11/21 DS TAIHEIYO CEMENT CORPORATION Refer to the following link for further information.
Application guidelines
2019/11/14 DS FUJI ELECTRIC CO., LTD. Refer to the following link for further information.
Application guidelines
2019/11/06 DS JX Nippon Mining & Metals Corporation Refer to the following link for further information.
Application guidelines
2019/11/08 DS/DL Ministry of Education, Culture, Sports, Science and Technology Refer to the following link for further information.
Application guidelines
2019/11/06 DS Iwatani Corporation Refer to the following link for further information.
Application guidelines
2019/10/31 DS Hitachi Automotive Systems, Ltd. Refer to the following link for further information.
Application guidelines
2019/10/30 DS Nippon Steel Engineering Refer to the following link for further information.
Application guidelines
2019/10/24 DS Chuoh Consultants Refer to the following link for further information.
Application guidelines
2019/10/24 DS Railway Technical Research Institute Refer to the following link for further information.
Application guidelines
2019/10/24 DS Nomura Research Institute Refer to the following link for further information.
Application guidelines
2019/10/24 DS DOJIN IYAKU-KAKO CO., LTD Refer to the following link for further information.
Application guidelines
2019/10/21 DS Ministry of Land, Infrastructure,Transport and Transport Refer to the following link for further information.
Application guidelines
2019/10/21 DS KUBOTA Corporation. Refer to the following link for further information.
Application guidelines
2019/10/21 DL Yamaha Corporation Refer to the following link for further information.
Application guidelines
2019/07/25 DS ShinMaywa Industries, Ltd. Refer to the following link for further information.
Application guidelines
2019/07/11 DS Nara Machinery Co., Ltd. Refer to the following link for further information.
Application guidelines
2019/06/18 DS Hokkaido Electric Power Co.,Inc. Refer to the following link for further information.
Application guidelines
2019/06/14 DS Nuclear Engineering and Services Company Refer to the following link for further information.
Application guidelines
2019/06/11 DS Rohm Refer to the following link for further information.
Application guidelines
2019/06/05 DS Nippon Light Metal Company Refer to the following link for further information.
Application guidelines
2019/06/04 DS TAISEI CORPORATION Refer to the following link for further information.
Application guidelines
2019/06/03 DS Nomura Research Institute Refer to the following link for further information.
Application guidelines
2019/06/03 DS JFE Steel Corporation Refer to the following link for further information.
Application guidelines
2019/06/03 DS HAZAMA ANDO CORPORATION Refer to the following link for further information.
Application guidelines
※Please let CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) know by Fri. 21st June. if you’d like to apply.
2019/05/30 DL Mitsubishi Aircraft Corporation Refer to the following link for further information.

※Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by June 13th.

2019/05/30 DL SECOM Intelligent Systems Laboratory Refer to the following link for further information.
Application guidelines
2019/05/30 DS/DL Amazon Web Services Refer to the following link for further information.
Application guidelines
2019/05/22 DS Fuji Techno Solutions Refer to the following link for further information.
Application guidelines
2019/05/22 DS AISIN COMCRUISE Refer to the following link for further information.
Application guidelines
2019/04/12 DL TOSHIBA Refer to the following link for further information.

※Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by May 24th.

2019/11/27 OS JX Nippon Oil & Exploration Corporation Refer to the following link for further information.
Application guidelines
2019/11/06 OS Thammasat University
(Thailand)
Program Schedule:1-2 month(s) during 1 February, 2020 – 31 July, 2020

Deadline: 11//11/2019
Refer to the following link for further information.
ProgramApplication forms
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.

2019/05/30 OS JX Nippon Oil & Exploration Corporation Refer to the following link for further information.
Application guidelines
2019/04/09 OS National Chung Hsing University
(Taiwan)
Program Schedule:31/07/2019~14/08/2019
Deadline: 15/04/2019
Engineering: 1 student
They will provide accommodation and food expenses.
Refer to the following link for further information.
Program
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS National Chung Cheng University
(Taiwan)
Program Schedule:for 6 weeks from August to September
Deadline: 26/04/2019
Engineering: 1 student
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS International Islamic University Malaysia
(Malaysia)
Deadline: 26/04/2019
Engineering: 4 students
They will provide accommodation.
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS Seoul National University
(Korea)
Deadline: 26/04/2019
Engineering: 5 students
They will provide financial support for maximum 2 months.
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS Queensland University of Technology
(Australia)
Deadline: 26/04/2019
Engineering: 2 students
They will provide financial support for maximum 2 months.
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS University of Alberta
(Canada)
Deadline: 26/04/2019
Engineering: 2 students
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS Rice University
(USA)
Deadline: 26/04/2019
Engineering: 1 student
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS University of Tulsa
(USA)
Deadline: 26/04/2019
Engineering: 1 student
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS Tampere University of Applied Sciences
(Finland)
Deadline: 26/04/2019
Engineering: 2 students
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS Steinmüller Engineering
(Germany)
Deadline: 26/04/2019
Engineering: 1 student
They will provide accommodation.
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2019/04/09 OS Takasago Thermal Engineering
(Malaysia)
Deadline: 26/04/2019
Engineering: 1 student
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2018/05/24 DL NIPPON STEEL & SUMITOMO METAL CORPORATION Refer to the following link for further information.
Application guidelines
2018/05/24 DS Ministry of Agriculture, Forestry and Fisheries Refer to the following link for further information.
Application guidelines
2018/05/16 DS MITSUBISHI HEAVY INDUSTRIES Refer to the following link for further information.
Application guidelines
2018/05/16 DS AISIN comCruise Co., Ltd. Refer to the following link for further information.
Application guidelines
2018/12/04 OS National Tsing Hua University
(Taiwan)
Program Schedule:
Session I 10/05/2019~11/07/2019
Session II 20/06/2019~22/08/2019
Deadline: 07/01/2019
Refer to the following link for further information.
Program
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2018/10/26 OS Rice University
(USA)
Program Schedule:16/02/2019~24/03/2019
Deadline: 12/11/2018
Refer to the following link for further information.
Program
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2018/05/16 OS National Chung Hsing University
(Taiwan)
Program Schedule:25/07/2018~08/08/2018
Deadline: 18/05/2018
Refer to the following link for further information.
Program
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2017/12/12 DS Hokkaido Cultural Broadcasting Refer to the following link for further information.
Application guidelines
2017/12/12 DS Yakult Refer to the following link for further information.
Application guidelines
2017/12/12 DS Hokkaido Electric Power Refer to the following link for further information.
Application guidelines
2017/11/17 DS Chuoh Consultants Refer to the following link for further information.
Application guidelines
2017/11/17 DS JFE Steel Refer to the following link for further information.
Application guidelines
2017/10/16 DS DAIKEN CORPORATION Refer to the following link for further information.
Application guidelines
2017/08/09 DS Fuji Electric Refer to the following link for further information.
Application guidelines
Theme
2017/06/16 DS Hokkaido Electric Power Refer to the following link for further information.
Application guidelines
2017/06/01 DS Ministry of Defense Refer to the following links for further information.
Application guidelines
*Please let CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) know by Fri. 30th June if you’d like to apply.
2017/06/01 DS JFE Steel Refer to the following links for further information.
Application guidelines
2017/05/11 DL SECOM Intelligent Systems Laboratory Refer to the following links for further information.
Application guidelines
2017/05/11 DS HAZAMA ANDO COROPERATION Refer to the following links for further information.
Application guidelines, Details of internship program
*Please let CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) know by Fri. 23rd Jun. if you’d like to apply.
2017/10/12 OS Rice University
(USA)
Program Schedule:01/04/2018~24/02/2018
Deadline: 02/11/2017
Refer to the following link for further information.
Program
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2017/05/11 OS National Chung Hsing University
(Taiwan)
Program Schedule:06/07/2017〜09/08/2017
Deadline:01/05/2017
Refer to the following link for further information.
Program
2017/02/24 OS The Hong Kong University of Science and Technology
(Hong Kong)
Program Schedule:09/07/2017~14/07/2017
Deadline: 31/03/2017
Refer to the following link for further information.
Program
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2016/12/07 OS Aalto University
(Finland)
Program Schedule:1/6/2017/~31/8/2017
Deadline:31/1/2017
Candidate:Undergraduate
Financial support:Presence (1450€ per a month.)
Refer to the following links for further information.
Aalto University portal site
Available positions
How to apply
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2016/12/07 OS Rice University
(USA)
Program Schedule:13/08/2017/~25/09/2017
Deadline:02/02/2017
Candidate:Undergraduate (Year1-3 at the point of application)
Refer to the following links for further information.
NAKATANI FOUNDATION
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.
2016/12/07 OS National Chung Cheng University
(Taiwan)
Deadline:18/01/2017
Refer to the following links for further information.
AIM-HI
※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.