Companies That Accept Internship Applications
Information on companies and institutes that host interns
The following is general recruiting information for interns hosted by companies interested in students from Hokkaido University School of Engineering/Graduate School of Engineering/Graduate School of Information Science and Technology/Graduate School of Chemical Sciences and Engineering.
Inquiry
Office of the Center for Engineering Education Development (room L200)
Tel.: 011-706-7163
E-mail: ceed-ind◆eng.hokudai.ac.jp
*Replace ◆ with an at sign.
List of companies and institutes that host interns
*When applying directly on a personal basis, you are required to mail a copy of the application forms to the CEED office, and to notify the office of the result of your application.
*When applying via the CEED, you are required to mail the necessary documents to the CEED office.
*DS: Domestic sort-term DL: Domestic long-term OS: Overseas ENG:Engineering students only
2022 (Domestic) / 2022 (Overseas) / 2021 (Domestic) / 2021 (Overseas) / 2020 (Domestic) / 2020 (Overseas)
2022（Domestic）
Please swipe to see.
NTTRefer to the following link for further information.
※To open the file,please send us an email to ask for the password.
Application guidelines(Maintenance technologies for conduits, manholes, and others)
Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by April 28th.
※To open the file,please send us an email to ask for the password.
Application guidelines(Maintenance technologies for conduits, manholes, and others)
Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by April 28th.
| Update | Categories | Host bodies | Notes |
|---|---|---|---|
| 2022/09/30 | DS | Re-Tech | Refer to the following link for further information. Application guidelines |
| 2022/09/21 | DS | Railway Technical Research Institute | Refer to the following link for further information. Application guidelines |
| 2022/08/03 | DS | JX Nippon Oil & Gas Exploration | Refer to the following link for further information. Application guidelines |
| 2022/07/11 | DS | transcosmos inc. | Refer to the following link for further information. Application guidelines |
| 2022/07/08 | DS | Hokkaido Electric Power CompanyIncorporated | Refer to the following link for further information. Application guidelines |
| 2022/07/08 | DS | Bridgestone Corporation | Refer to the following link for further information. Application guidelines |
| 2022/06/29 | DS | MAEDA ROAD CONSTRUCTION Co.,Ltd | Refer to the following link for further information. Application guidelines |
| 2022/06/29 | DS | SINKO INDUSTRIES LTD. | Refer to the following link for further information. Application guidelines |
| 2022/06/28 | DS | City of Sapporo | Refer to the following link for further information. Application guidelines |
| 2022/06/22 | DS ENG |
SHIMIZU CORPORATION | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines |
| 2022/06/13 | DS | RSJP | Refer to the following link for further information. Application guidelines |
| 2022/06/10 | DS | Civil Engineering Research Institute for Cold Region | Refer to the following link for further information. Application guidelines |
| 2022/06/09 | DS | SUZUKI MOTOR CORPORATION | Refer to the following link for further information. Application guidelines |
| 2022/06/08 | DS | Railway Technical Research Institute | Refer to the following link for further information. Application guidelines |
| 2022/06/08 | DS | Mitsubishi Heavy Industries Environmental & Chemical Engineering Co., Ltd. | Refer to the following link for further information. Application guidelines |
| 2022/06/08 | DS | SUNAGO | Refer to the following link for further information. Application guidelines |
| 2022/06/08 | DS | KAWADA INDUSTRIES, INC. | Refer to the following link for further information. Application guidelines |
| 2022/06/03 | DS | Aomori Prefecture Construction Company | Refer to the following link for further information. Application guidelines |
| 2022/06/02 | DS | FUJI ELECTRIC CO., LTD. | Refer to the following link for further information. Application guidelines |
| 2022/05/26 | DS | NIMS | Refer to the following link for further information. Application guidelines |
| 2022/05/23 | DL ENG |
toshiba | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines・Application forms Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by June 17th.The information seminar will be held on June 7.Refer to the following link for further information. the information seminar1・the information seminar2 Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by June 5th. |
| 2022/05/19 | DS | MARUHIKO WATANABE CONSTRUCTION.inc | Refer to the following link for further information. Application guidelines |
| 2022/05/19 | DS | JAEA | Refer to the following link for further information. Application guidelines |
| 2022/05/19 | OS | BOSCH | Refer to the following link for further information. Application guidelines |
| 2022/05/12 | DS | Japan Water Agency | Refer to the following link for further information. Application guidelines URL |
| 2022/05/12 | DS ENG |
KITANIHON SEIKI CO.,LTD. | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by June 14th. |
| 2022/04/18 | DS | Re-Tech | Refer to the following link for further information. Application guidelines |
| 2022/04/11 | DS | JEED | Refer to the following link for further information. Application guidelines |
| 2022/04/06 | DS ENG |
NTT | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by May 6th. |
| 2022/03/18 | DS | IKEDA AIRCONDITIONING Co.,LTD | Refer to the following link for further information. Application guidelines |
| 2022/03/10 | DS | DIC SOLUTION ENGINEERING INC. | Refer to the following link for further information. Application guidelines |
| 2022/03/10 | DS | IRIS OHYAMA Inc. | Refer to the following link for further information. Application guidelines |
2022 (Overseas)
Please swipe to see.
| Update | Categories | Host bodies | Notes |
|---|---|---|---|
| 2022/07/05 | OS | Rice University/Lehigh University （USA） |
Program Schedule：06/09/2022～19/09/2022, and 13/02/2023～17/03/202３ Deadline: 01/08/2022 Refer to the following link for further information. Program ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.〇Registration： go.lehigh.edu/tomodachistem |
| 2022/05/02 | OS ENG |
National Chung Cheng University （Taiwan） |
Deadline: 06/05/2022 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 1 student Program Schedule：for 6 weeks from August to September ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2022/05/02 | OS ENG |
International Islamic University Malaysia （Malaysia） |
Deadline: 06/05/2022 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 4 students They will provide accommodation. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2022/05/02 | OS ENG |
Seoul National University （Korea） |
Deadline: 06/05/2022 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 5 students They will provide financial support for maximum 2 months. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2022/05/02 | OS ENG |
Queensland University of Technology （Australia） |
Deadline: 06/05/2022 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students They will provide financial support for maximum 2 months. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2022/05/02 | OS ENG |
University of Alberta （Canada） |
Deadline: 06/05/2022 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2022/05/02 | OS ENG |
Rice University （USA） |
Deadline: 06/05/2022 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 1 student ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2022/05/02 | OS ENG |
Tampere University of Applied Sciences （Finland） |
Deadline: 06/05/2022 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2022/05/02 | OS ENG |
Steinmüller Engineering （Germany） |
Deadline: 06/05/2022 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 1 graduate student They will provide accommodation. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| OS ENG |
TRUMPF （Germany） |
||
| 2022/05/02 | OS ENG |
Takasago Thermal Engineering （Malaysia） |
Cancelled for the year of 2022 due to Covid-19 pandemic. |
2021（Domestic）
Please swipe to see.
| Update | Categories | Host bodies | Notes |
|---|---|---|---|
| 2022/01/25 | DS | morimoto kouzousekkeizimusyo | Refer to the following link for further information. Application guidelines |
| 2022/01/14 | DS | iwasaki | Refer to the following link for further information. Application guidelines |
| 2021/12/27 | DS | JX Nippon Oil Gas Exploration | Refer to the following link for further information. Application guidelines |
| 2021/12/27 | DS | Hokkaido Electric Power Co.,Inc. | Refer to the following link for further information. Application guidelines |
| 2021/11/25 | DS | TOTO LTD. | Refer to the following link for further information. Application guidelines |
| 2021/11/24 | DS | DIC Corporation | Refer to the following link for further information. Application guidelines |
| 2021/11/19 | DS | Re-Tech | Refer to the following link for further information. Application guidelines |
| 2021/11/16 | DS | PERSOL AVC TECHNOLOGY CO., LTD. | Refer to the following link for further information. Application guidelines |
| 2021/11/16 | DS | SHINRYO CORPORATION | Refer to the following link for further information. Application guidelines |
| 2021/11/16 | DS | Central Japan Railway Company | Refer to the following link for further information. Application guidelines |
| 2021/11/12 | DS | IAI | Refer to the following link for further information. Application guidelines |
| 2021/11/08 | DS | TOSHIBA CORPORATION | Refer to the following link for further information. Application guidelines |
| 2021/11/08 | DS | TAISEI CORPORATION | Refer to the following link for further information. Application guidelines |
| 2021/10/14 | DS | Otomi Kogyo | Refer to the following link for further information. Application guidelines |
| 2021/10/04 | DS | SHINRYO CORPORATION | Refer to the following link for further information. Application guidelines |
| 2021/09/28 | DS | Railway Technical Research Institute | Refer to the following link for further information. Application guidelines |
| 2021/09/01 | DS | TAIHO PHARMACEUTICAL CO., LTD. | Refer to the following link for further information. Application guidelines |
| 2021/08/13 | DS | Schlumberger Limited | Refer to the following link for further information. Application guidelines |
| 2021/08/12 | DL | Japan Business Art inc | Refer to the following link for further information. Application guidelines |
| 2021/08/05 | DS | OBAYASHI CORPORATION | Refer to the following link for further information. Application guidelines |
| 2021/08/05 | DS | Japan Freight Railway Company | Refer to the following link for further information. Application guidelines |
| 2021/07/21 | DS | JX Nippon Oil Gas Exploration | Refer to the following link for further information. Application guidelines |
| 2021/07/21 | DS | Japan Groundwater Development CO.,LTD. | Refer to the following link for further information. Application guidelines |
| 2021/07/16 | DS | TDK Corporation | Refer to the following link for further information. Application guidelines |
| 2021/07/15 | DS | Swing Corporation | Refer to the following link for further information. Application guidelines |
| 2021/07/15 | DS | Chuoh Consultants | Refer to the following link for further information. Application guidelines |
| 2021/07/06 | DS | Roland DG Corporation | Refer to the following link for further information. Application guidelines |
| 2021/07/01 | DS | SANGO | Refer to the following link for further information. Application guidelines |
| 2021/07/01 | DS | ADVANTEST | Refer to the following link for further information. Application guidelines |
| 2021/06/29 | DS | City of Sapporo | Refer to the following link for further information. Application guidelines |
| 2021/06/29 | DS | Hokkaido Railway Company | Refer to the following link for further information. Application guidelines |
| 2021/06/29 | DS | Qualysite Technologies Inc. | Refer to the following link for further information. Application guidelines |
| 2021/06/29 | DS | TAIYO KOGYO CORPORATION | Refer to the following link for further information. Application guidelines |
| 2021/06/29 | DS ENG |
SHIMIZU CORPORATION | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines・Application forms |
| 2021/06/28 | DS | iwasaki | Refer to the following link for further information. Application guidelines |
| 2021/06/25 | DS | MAKINO TECHNICAL SERVICE | Refer to the following link for further information. Application guidelines |
| 2021/06/24 | DS | SEKISUI CHEMICAL CO., LTD. | Refer to the following link for further information. Application guidelines |
| 2021/06/24 | DS | Nippon Koei Co., Ltd. | Refer to the following link for further information. Application guidelines |
| 2021/06/23 | DS | Hokkaido Electric Power Co.,Inc. | Refer to the following link for further information. Application guidelines |
| 2021/06/18 | DS | West Nippon Expressway Company Limited | Refer to the following link for further information. Application guidelines |
| 2021/06/18 | DS | FUJI ELECTRIC CO.LTD. | Refer to the following link for further information. Application guidelines |
| 2021/06/11 | DS | Renesas Electronics Corporation | Refer to the following link for further information. Application guidelines |
| 2021/06/10 | DS | Hitachi Industry & Control Solutions, Ltd. | Refer to the following link for further information. Application guidelines |
| 2021/06/10 | DS | Railway Technical Research Institute | Refer to the following link for further information. Application guidelines |
| 2021/06/07 | DS | TOYOTA PRODUCTION ENGINEERING | Refer to the following link for further information. Application guidelines |
| 2021/06/01 | DS | Asahi-Diamond-Industrial-Co.Ltd etc | Refer to the following link for further information. Application guidelines |
| 2021/06/01 | DS | TAIYO HOLDINGS CO,.LTD. | Refer to the following link for further information. Application guidelines |
| 2021/06/01 | DS | Re-Tech | Refer to the following link for further information. Application guidelines |
| 2021/05/20 | DS | TOSHIBA PLANT SYSTEMS SERVICES CORPORATION | Refer to the following link for further information. Application guidelines |
| 2021/05/19 | DS | NIPPON STEEL ENGINEERRING | Refer to the following link for further information. Application guidelines |
| 2021/05/19 | DS ENG |
KITANIHON SEIKI CO.,LTD. | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by June 18th. |
| 2021/05/13 | DS | KYOKUTO KOWA CORPORATION | Refer to the following link for further information. Application guidelines |
| 2021/04/30 | DS | Nomura-Research-Institute-Ltd. | Refer to the following link for further information. Application guidelines |
| 2021/04/23 | DL ENG |
toshiba | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines・Application forms Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by June 3th.The information seminar will be held on may 14.Refer to the following link for further information. the information seminar1・the information seminar2 Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by May 6th. |
| 2021/04/09 | DL | NIMS | Refer to the following link for further information. Application guidelines |
| 2021/04/05 | DL ENG |
NTT | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines(Maintenance technologies for conduits, manholes, and others) Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by April 28th. |
| 2021/03/19 | DS | JEED | Refer to the following link for further information. Application guidelines |
| 2021/03/03 | DS | FORUM8 | Refer to the following link for further information. Application guidelines |
| 2021/03/01 | DS | wakasuzu-consultants | Refer to the following link for further information. Application guidelines |
2021 (Overseas)
Please swipe to see.
| Update | Categories | Host bodies | Notes |
|---|---|---|---|
| 2021/07/21 | OS | Rice University/Lehigh University （USA） |
Program Schedule：07/09/2021～24/09/2021, and 12/02/2022～17/03/2022 Deadline: 13/08/2021 Refer to the following link for further information. Program ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information.＜TOMODACHI_STEM online info session(mainly conducted in Japanese)＞〇Date & Time：August 3rd, 2021 (Tue.) from 9:00 P.M. to 10:00 P.M.〇Contents：(1) overview of the program (conducted in English)(2) Panel discussion and Question-and-answer session by past participants
〇Registration https://bit.ly/3yRBFBc ※Registration is required for TOMODACHI_STEM online info session. ※Participation for TOMODACHI_STEM online info session is not required to apply for this program. |
| 2021/04/22 | OS ENG |
National Chung Cheng University （Taiwan） |
Deadline: 14/05/2021 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 1 student Program Schedule：for 6 weeks from August to September ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2021/04/22 | OS ENG |
International Islamic University Malaysia （Malaysia） |
Deadline: 14/05/2021 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 4 students They will provide accommodation. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2021/04/22 | OS ENG |
Seoul National University （Korea） |
Deadline: 14/05/2021 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 5 students They will provide financial support for maximum 2 months. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2021/04/22 | OS ENG |
Queensland University of Technology （Australia） |
Deadline: 14/05/2021 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students They will provide financial support for maximum 2 months. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2021/04/22 | OS ENG |
University of Alberta （Canada） |
Deadline: 14/05/2021 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2021/04/22 | OS ENG |
Rice University （USA） |
Deadline: 14/05/2021 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 1 student ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2021/04/22 | OS ENG |
Tampere University of Applied Sciences （Finland） |
Deadline: 14/05/2021 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2021/04/22 | OS ENG |
Steinmüller Engineering （Germany） |
Deadline: 14/05/2021 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 1 graduate student They will provide accommodation. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2021/04/22 | OS ENG |
TRUMPF （Germany） |
Cancelled for the year of 2021 due to Covid-19 pandemic. |
| 2021/04/22 | OS ENG |
Takasago Thermal Engineering （Malaysia） |
Cancelled for the year of 2021 due to Covid-19 pandemic. |
2020（Domestic）
Please swipe to see.
| Update | Categories | Host bodies | Notes |
|---|---|---|---|
| 2020/12/23 | DL | KYOTO-SEMICONDUCTOR-Co.-Ltd. | Refer to the following link for further information. Application guidelines |
| 2020/12/22 | DS | ADVANTEST | Refer to the following link for further information. Application guidelines |
| 2020/12/04 | DS | JX-Nippon-Oil-Gas-Exploration | Refer to the following link for further information. Application guidelines・Application forms |
| 2020/12/02 | DS | nuclear regulatory agency | Refer to the following link for further information. Application guidelines |
| 2020/12/02 | DS | IAI | Refer to the following link for further information. Application guidelines |
| 2020/11/13 | DS | Railway-Technical-Research-Institute | Refer to the following link for further information. Application guidelines |
| 2020/09/23 | DS | Nomura-Research-Institute-Ltd. | Refer to the following link for further information. Application guidelines |
| 2020/08/07 | DS | JDC-CORPORATION | Refer to the following link for further information. Application guidelines |
| 2020/08/06 | DS | Bank-of-Japan | Refer to the following link for further information. Application guidelines |
| 2020/08/05 | DS | Tokushima-Prefecture | Refer to the following link for further information. Application guidelines |
| 2020/08/04 | DS | Oriental-Consultants-Global-Co.-Ltd. | Refer to the following link for further information. Application guidelines |
| 2020/07/31 | DS | Yokogawa-Bridge-Holdings-Corp. | Refer to the following link for further information. Application guidelines |
| 2020/07/27 | DS ENG |
NIPPON-STEEL-CORPORATION | Refer to the following link for further information. Application guidelines |
| 2020/07/14 | DL | National-Institute-for-Materials-Science(NIMS) | Refer to the following link for further information. Application guidelines |
| 2020/07/14 | DS | Nagano-Prefecture | Refer to the following link for further information. Application guidelines |
| 2020/07/14 | DS | MITSUBISHI-HEAVY-INDUSTRIES-ENVIRONMENTAL-CHEMICAL-ENGINEERING | Refer to the following link for further information. Application guidelines・Application forms |
| 2020/07/14 | DS | FUJI-ELECTRIC-CO.-LTD. | Refer to the following link for further information. Application guidelines |
| 2020/07/14 | DS | ADVANTEST | Refer to the following link for further information. Application guidelines |
| 2020/06/26 | DL | East-Japan-Railway-Company | Refer to the following link for further information. Application guidelines |
| 2020/06/26 | DS | JX-Nippon-Oil-Gas-Exploration | Refer to the following link for further information. Application guidelines・Application forms |
| 2020/06/22 | DS | JFE-Steel-Corporation | Refer to the following link for further information. Application guidelines |
| 2020/06/18 | DS ENG |
ＵＨＢ | Refer to the following link for further information. Application guidelines |
| 2020/06/18 | DL | KPMG Ignition Tokyo | Refer to the following link for further information. Application guidelines |
| 2020/06/17 | DS | Toyoda Gosei Co., Ltd. | Refer to the following link for further information. Application guidelines |
| 2020/06/17 | DS | Nippon Sheet Glass Company, Ltd | Refer to the following link for further information. Application guidelines |
| 2020/06/08 | DS | Railway-Technical-Research-Institute | Refer to the following link for further information. Application guidelines |
| 2020/06/04 | DS | Nomura-Research-Institute-Ltd | Refer to the following link for further information. Application guidelines |
| 2020/06/04 | DS | TOSHIBA-PLANT-SYSTEMS-SERVICES-CORPORATION | Refer to the following link for further information. Application guidelines |
| 2020/04/13 | DL ENG |
Mitsubishi-Aircraft-Corporation | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines・Application forms Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by May 22th. |
| 2020/04/13 | DL ENG |
toshiba | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines・Application forms Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by June 10th.The information seminar will be held on June 5.Refer to the following link for further information. the information seminar Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by May 28th. |
| 2020/03/04 | DS | wakasuzu-consultants | Refer to the following link for further information. Application guidelines |
| 2019/10/18 | DL | Mitsubishi Aircraft Corporation | Refer to the following link for further information. ※To open the file,please send us an email to ask for the password. Application guidelines・Application forms Submit the application form to CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.)by December 20th. |
2020 (Overseas)
Please swipe to see.
| Update | Categories | Host bodies | Notes |
|---|---|---|---|
| 2020/07/14 | OS ENG |
National Chung Cheng University （Taiwan） |
Program Schedule：for 6 weeks from August to September Cancelled for the year of 2020 due to Covid-19 pandemic. |
| 2020/07/14 | OS ENG |
International Islamic University Malaysia （Malaysia） |
Deadline: 07/08/2020 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 4 students They will provide accommodation. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2020/07/14 | OS ENG |
Seoul National University （Korea） |
Deadline: 07/08/2020 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 5 students They will provide financial support for maximum 2 months. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2020/07/14 | OS ENG |
Queensland University of Technology （Australia） |
Deadline: 07/08/2020 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students They will provide financial support for maximum 2 months. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2020/07/14 | OS ENG |
University of Alberta （Canada） |
Deadline: 07/08/2020 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2020/07/14 | OS ENG |
Rice University （USA） |
Deadline: 07/08/2020 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 1 student ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2020/07/14 | OS ENG |
Tampere University of Applied Sciences （Finland） |
Deadline: 07/08/2020 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 2 students ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2020/07/14 | OS ENG |
Steinmüller Engineering （Germany） |
Deadline: 07/08/2020 ※There can be some remaining posts. Please don’t hesitate to ask us even if it’s after the deadline. Engineering: 1 graduate student They will provide accommodation. ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |
| 2020/07/14 | OS ENG |
TRUMPF （Germany） |
Cancelled for the year of 2020 due to Covid-19 pandemic. |
| 2020/07/14 | OS ENG |
Takasago Thermal Engineering （Malaysia） |
Cancelled for the year of 2020 due to Covid-19 pandemic. |
| 2020/02/07 | OS | Rice University （USA） |
Program Schedule：13/08/2020～21/09/2020 Deadline: 26/02/2020 Refer to the following link for further information. Program ※Contact CEED office (ceed-ind◆eng.hokudai.ac.jp *Replace ◆ with an at sign.) for further information. |